News and Events



E.g., 2018-07-23
E.g., 2018-07-23
Headline Date
New Vishay Intertechnology TMBS® Rectifiers in MicroSMP package save significant space while increasing power density and improving efficiency
 1 A and 2 A Devices Feature Low 0.65 mm Profile and Forward Voltage Drop Down to 0.36 V Vishay Intertechnology Inc. (NYSE: VSH) has recently expanded its offering of surface-mount TMBS® Trench MOS Barrier Schottky rectifiers with 10... MORE /
28 Sep 2017
Microchip unveils next-generation In-Circuit Debugger (ICD) with unparalleled speed and flexibility
 Microchip has announced the MPLAB® ICD 4, an in-circuit programming and debugging development tool for Microchip’s PIC® microcontroller and dsPIC® digital signal controller portfolios.  The MPLAB ICD 4 includes all the... MORE /
28 Sep 2017
Cypress Extends Scalability of Automotive MCU Portfolio with New Series for Secure, High-Speed Networking in Instrument Clusters and Body Applications
 New 40nm High-performance Traveo™ MCUs Support CAN FD Networking, eSHE Security and High-quality Sound, while Adding Graphics in Classic Cluster Applications. Cypress Semiconductor Corp. (NASDAQ: CY) has announced it is sampling new... MORE /
28 Sep 2017
Infineon introduces packaged MEMS microphones with a 70 dB signal-to-noise ratio
 Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is entering the packaged silicon microphone market. With this it is addressing the need for high performance, low noise MEMS microphones. The analogue and digital microphones are based on Infineon... MORE /
28 Sep 2017
Cypress Streamlines Wireless Design for Smart Home Applications with Addition of iCloud Support to IoT Development Platform
 Cypress Semiconductor Corp. (NASDAQ: CY), the leader in wireless connectivity solutions for the Internet of Things (IoT), has announced an updated version of its turnkey development platform for the IoT that simplifies the integration of wireless... MORE /
28 Sep 2017
Bluetooth 4.2 Host Command Interface module with integrated chip antenna and audio support
 Telit have introduced the Bluetooth 4.2 Host Controller Interface module with integrated chip antenna: The BL871E2-HI.The ultra-compact component is optimized for efficiency and simplicity in end-device design, delivering reliable Bluetooth... MORE /
27 Sep 2017
EUROQUARTZ TO LAUNCH NEW HIGH FREQUENCY ULTRA-LOW JITTER OSCILLATORS AT EMBEDDED DESIGN SHOW 2017
 Frequency control specialist, Euroquartz is launching two new ranges of oscillators at the forthcoming Embedded Design Show (EDS  2017, October 18th & 19th, Ricoh Arena, Coventry, UK). Offering ultra-low phase jitter of 150fs typical, the... MORE /
27 Sep 2017
Murata partners with STMicro to add SigFox connectivity to its LoRaWAN module enabling “Best of Both Worlds” capability
Arrow Altech has announced the availability of the new ultra-compact, low-cost, low-power-wide- area-network (LPWAN) wireless module that supports the LoRaWAN & Sigfox long range wireless protocol.Last week, Murata announced the results of its... MORE /
26 Jul 2017
LoRa Module Data Sheet
Murata announced the launch of a compact low cost low power wide area network (LPWAN) wireless module that supports the LoRaWAN long range wireless protocol. This stand-alone compact module measures just 12.5 x 11.6 x 1.76 mm, is constructed in a metal... MORE /
7 Nov 2016
Low-cost Exclusion Zone Solutions for Operator Safety
Expanding the swarm bee product family.Berlin, February 23, 2016 – As part of its joint initiative with Decawave, a leader in ultra-wideband (UWB) Micro-Location semiconductors, to simplify how developers utilize UWB location-awareness nanotron... MORE /
7 Jun 2016