News and Events
Title | Date |
|---|---|
| TI unveils industry's first 4-MB Flash memory device for harsh environments Texas Instruments Incorporated introduced the industry's first high-temperature, nonvolatile Flash memory device for harsh environments. The SM28VLT32-HT has an operational capacity of 4 MB and eliminates the need for costly up-screening and qualification testing of industrial-grade components for temperature ranges outside data sheet specifications. The device allows data logging at extreme temperatures and is guaranteed for at least 1,000 hours of operating life in harsh environment applications, including oil and gas exploration, heavy industrial, and avionics. | 11 February 2013 |
| TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets Consistent with previously stated strategic plans, Texas Instruments announced it will reduce costs and focus investments in its Wireless business on embedded markets with greater potential for sustainable growth. Cost reductions include the elimination of about 1,700 jobs worldwide. | 11 February 2013 |
| TI NexFET™ Power Block Delivers Maximum Efficiency, Frequency and Power Density in Half the Size of Discretes High-performance synchronous device stacks two NexFET MOSFETs in a single package to support high-current, multi-phase, POL applications | 2 July 2010 |
| TI Isolated Amplifier, Modulator Enable High-Precision Current Measurement in Motor Control, Green Energy Applications Devices improve system performance while reducing power consumption | 31 October 2011 |
| TI Introduces SAR ADC with Intelligent System Power Management Can lower power across the system by more than 50 percent in medical, communications, remote sensor signal monitoring and energy harvesting applications Texas Instruments Incorporated introduced the 12-bit ADS7924 successive approximation (SAR) analog-to-digital converter (ADC). Through intelligent system power management features, the 2.2-V ADS7924 works with any low-power system requiring sensor monitoring to potentially lower power across the system by more than 50 percent. For more information, visit www.ti.com/ads7924-pr. | 24 August 2010 |
| TI Introduces NexFET™ Power Block Devices in a 3 mm x 3 mm Package DALLAS, March 14, 2011 /PRNewswire/ -- Texas Instruments Incorporated (TI) (NYSE: TXN) introduced a new NexFET Power Block device in a space-saving 3-mm x 3-mm SON package. The new CSD86330Q3D Power Block package achieves greater than 90 percent efficiency at 15 A in half the area of competitive solutions that require two discrete power MOSFETs in 3-mm x 3-mm QFN packages. | 23 March 2011 |
| TI Introduces Industry's Highest Accuracy Lithium-Ion Battery Monitor for Electric Mobility, Power Tools and UPS Intelligent IC extends battery pack lifetime, energy delivery and system safety | 30 May 2011 |
| TI Introduces Industry's First Single-Chip Battery Management Device for Highly integrated, standalone device provides complete pack protection and cell-balancing for 4- to 10-cell lithium battery packs | 3 October 2011 |
| TI Introduces Industry's First 100-V Synchronous Buck Regulator with Integrated MOSFETs New family of highly integrated, pin-compatible ICs reduces PCB area and improves reliability in high-voltage applications | 1 February 2012 |
| TI Introduces 2.5-A, 60-V Step-Down SWIFT™ DC/DC Converter Wide input-voltage converter provides fast transient response, high efficiency to industrial low-power systems and GSM/GPRS modules | 7 June 2010 |
